The Infinera XT/S-3600 is a high-performance packet-optical networking platform designed for service providers and large enterprises. It offers high capacity, flexibility, multi-layer optimization, scalability, carrier-class reliability, integrated management, and green technology features.
PICS Telecom offers the largest inventory of new and used multi-vendor telecom network products and data equipment. Providing critical spares and services to over 2000 customers in over 100 countries. All equipment provided is thoroughly tested to ensure it is in excellent working condition and is backed by PICS’ comprehensive warranty.
Key Features:
- High capacity: The XT/S-3600 offers up to 2.4 terabits per second (Tbps) of switching capacity, making it one of the most powerful packet-optical networking platforms available.
- Flexible and modular: The platform is modular and can be configured to support a wide range of services and applications. It also supports multiple line rates and service interfaces, including 10G, 40G, and 100G Ethernet.
- Multi-layer optimization: The XT/S-3600 integrates advanced optical and packet switching technologies to provide multi-layer optimization, enabling efficient use of network resources and improved network performance.
- Scalability: The platform is highly scalable and can be easily upgraded to support higher capacity and new services as network demands grow.
- Carrier-class reliability: The XT/S-3600 is designed to meet the high availability and reliability requirements of carrier-class networks, with redundant power supplies, fans, and control modules, as well as advanced network protection mechanisms.
- Integrated management: The platform includes a comprehensive suite of management and control tools, including the Infinera Digital Network Administrator (DNA) management system, which provides end-to-end visibility and control over network operations.
- Green technology: The XT/S-3600 is designed to minimize power consumption and reduce carbon footprint, with features such as low power consumption, intelligent power management, and high-density packaging.
